Assembly

FPNA’s assembly Facility specialized in quick turn Prototype and middle volume turnkey assembly (component purchasing, PCB assembly, Functional testing, Box build).

  • 10 mixed SMT Production Lines for prototype & middle volume for Machine Capacity of 8 Million points per day
  • Lead time: 48hours for quick turn prototype (QTY ≤ 50pcs), 3~5 days for middle volume (QTY>50pcs,NO DIP)
  • 8 parts per Line a day
  • 2 Manual Insertion Lines
  • 2 Manual Touch up Lines
  • 1 Selective Solder Wave Machine (Lead Free & Non Lead Free)
  • 1 Lead-Free Solder Wave Machine
  • 2 Assembly Box Build Lines for Lead Free & Non Lead Free
  • 300,000 points/hr
  • 50,000 panels/wk
  • 190 jobs/wk
  • 200 team members
  • Pre engineering
  • BOM checking
  • Setting up the programming
  • DFM (design for manufacturability)
  • PCBA Soldering
  • Functional Test
    – SPI Test, ICT Test
  • 0.0197”-0.394” thickness
  • 2.364” * 2.364” PCB Board Size (Min)
  • 27.55” * 23.64” PCB Board Size (Max)
  • 10kg PCB Quality (MAX)
  • Mounting Accuracy 1.4mil
  • Telecom & Network
  • Industrial
  • Computer Peripherals
  • Medical
  • Automotive
  • Material Procurement and Management
  • PCBA placement
  • PTH components soldering
  • Rigid ,Rigid & Flex PCB, Metal PCB
  • POP
  • BGA re-ball and X-ray inspection
  • ICT, Functional testing and AOI Inspection
  • Press fit connector assembly
  • Stencil Fabrication-in house
  • PCBA cleaning
  • PCBA coating
  • Box build, testing of assemblies
  • Function testing of assemblies
  • Resistance YAGEO
  • Capacitance MURATA
  • IC NXP,FSC TI
  • Connector SAMTEC MOLEX
  • Smallest Component Size: 01005
  • Max Component Size: 50*150mm
  • BGA Pitch ≥ 0.4mm
  • BGA ball size(Dia.):0.2~1.0mm
  • BGA size(Max): 50*50mm
  • Lead Pitch ≥ 0.3mm
  • Wave Solder
  • Selective Wave Solder
  • No Clean & Automatic
  • PCB width(wave solder) :50~450mm
  • Max PCB size (selective wave solder) :406*508mm
  • All parts need to be Hand Soldered

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