Backplane

Backplane Roadmap

Item201620172018
Shipping panel size (max)
22.5“ x 47"22.5“ x 47"22.5“ x 47"
Working PNL size (max) 24“ x 49" 24“ x 49" 24“ x 49"
Base materialIT180A, TU862, TU872SLK, Nelco 4000, MW1000/2000, Megtron 4, Megtron 6, Megtron 7, ISOLA/ROGERS/NELCO/TACONIC etc.
Minimum dielectric thicknessMin thin core 2 milMin thin core 2 milMin thin core 2 mil
Layer to Layer Registration6 mil6 mil5 mil
Max. Layer counts60 layer 60 layer60 layer
Minimum hole diameter8 mil6 mil6 mil
Finish PRESS FIT hole tolerance ±2 mil±2 mil±2 mil
PTH aspect ratioHole diameter 0.35 mm 20:1Hole diameter 0.35 mm 20:1 Hole diameter 0.35 mm 20:1
Finished board thickness0.236”0.394”0.394”
Surface TreatmentENIG/OSP//IMSnENIG/OSP//IMSn
Back drilling precision accuracy8 mil8 mil8 mil
Deep control routing accuracy±4 mil±4 mil±4 mil
Hybrid High frequency processYesYesYes
Delivery high speed25G25G25G

Backplane size: 12.97” * 31.32”
Layer: 14L
Material: IT-180A
Thickness: 0.196”
Minimum hole diameter: 18 mil
Aspect ratio: 11
Ink color: green
Surface treatment: ENIG

25G High Speed Backplane
Size: 34”*19”
Layer: 28L
Material: MEGTRON 6
Thickness: 0.212”
Minimum hole diameter: 17 mil
Aspect ratio: 12.6
Ink color: green
Surface treatment: ENIG

25G High Speed Backplane
Size: 34”*19”
Layer: 28L
Material: Meteorwave1000
Thickness: 0.197”
Minimum hole diameter: 17 mil
Aspect ratio: 11.76
Ink color: blue
Surface treatment: ENIG

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