Guangzhou Facility

FPNA's Guangzhou facility specialties & product focus


Key Statistics:

  • 840,000 sq. ft. facility
  • 45,500 panels/wk.
  • 91,000 cores/wk.
  • 3,500 jobs/wk.
  • 1,500 new tools/wk.
  • 6 layer avg.
  • 20 sq. ft. size avg
  • 3,000+ team member

Surface Finishes:

  • Leaded HASL
  • Lead Free HASL
  • OSP
  • ENIG
  • ENEPIG
  • Plating (Ni) Soft/Hard Gold
  • Immersion Tin
  • Immersion Silver

Engineering Services:

  • Design for Manufacturing (DFM)
  • Front-End Technical Engineers
  • Software; Cam350, ODB++, DXF Format & Genesis
  • Netlist Compare & Impedance Calculations
  • ISO Documentation Control
  • Lab Services

Major Market Segments:

  • Telecom & Network
  • Industrial & Instrumentation
  • Computer / Datacom
  • Medical
  • Automotive

Materials:

  • > 30 material types
  • FR-4: S1141 (normal Tg) S1000H, IT 158 (mid Tg) IT-180A, TU768 (high Tg)
  • High speed: TU862HF, S1165 (Mid loss) N4000-13, TU872SLK, Megtron 4 (low loss) Megtron 6, RO4350, TU883, (very low loss) Megtron 7, Tachyon 100G, (ultra low loss)
  • PTFE Laminates: Taconic (TLX, TLF, TLY, RF, TLC, TLG series); Arlon (Diclad, AD series)

Key Technical Capabilities:

  • Up to 60 layers
  • 0.00788”- 0.3152” thickness
    0.394” x 0.394” Finished Board Size (MIN)
  • 24.5” x 49” Finished Board Size (MAX)
    -0.5% min Bow & Twist
  • Impedance Tolerance ±5ohm(<50ohm), ±7%(≥50ohm) (high speed ±5%)
  • Line width/space for inner layer(min) 2/2mil
  • Line width/space for inner Outer(min) 2/2mil
  • PTH Aspect Ratio 40:1
  • Mechanical hole diameter(min) 6mil
  • Laser Drilling Size(min) 3 mil
  • HDI Type 4+N+4

Yixing Facility

FPNA's Yixing facility specialties & product focus


  • High Layer Count
  • HDI
  • Backplane, ATE, BIB
  • RF / High Speed Critical / HDI

Key Statistics:

  • 1,054,800 sq. ft. facility
  • 16,852 panels/wk.
  • 50,557 cores/wk.
  • 325 jobs/wk.
  • 22  new tools/wk.
  • 8 layer avg
  • 107 sq. ft. size avg
  • 580 team members

Surface Finishes:

  • Leaded HASL
  • Lead free HASL
  • OSP
  • ENIG
  • ENEPIG
  • Plating (Ni) Soft/Hard Gold
  • Immersion Tin
  • Immersion Silver

Engineering Services:

  • Design for Manufacturing (DFM)
  • Front-End Technical Engineers
  • Software; Cam350, ODB++
  • DXF Format & Genesis
  • Netlist Compare & Impedance Calculations
  • ISO Documentation Control
  • Lab Services

Major Market Segments:

  • Telecom & Network
  • Industrial
  • Computer Peripherals
  • Medical
  • Automotive

Materials:

  • > 30 material types
  • FR-4: S1141 (normal Tg) S1000H, IT 158 (mid Tg) IT-180A, TU768 (high Tg)
  • High Speed: TU862HF, S1165 (Mid loss) N4000-13, TU872SLK, Megtron 4 (low loss) Megtron 6, RO4350, TU883, (very low loss) Megtron 7, Tachyon 100G, (ultra low loss)
  • PTFE Laminates: Taconic (TLX,TLF, TLY, RF, TLC, TLG series); Arlon (Diclad, AD series)

Key Technical Capabilities:

  • Up to 40 layer
  • 0.00788” – 0.394” thickness
  • 0.394″ x 0.394″ Finished Board Size (min)
  • 22.50″ x 47.00″ Finished Board Size (max)
  • Impedance Tolerance ±5ohm (<50ohm), ±10% (≥50ohm)
  • Line width/space for inner layer(min) 2.5/2.5mil
  • Line width/space for inner Outer(min) 2.5/2.5mil
  • PTH Aspect Ratio 20:1
  • Mechanical hole diameter(min) 6mil
  • Laser Drilling Size(min) 4mil
  • HDI Type 3+N+3

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