Flex & Rigid Flex

Flex and Rigid-Flex Overview

Adhesiveless Rigid-Flex Overview

PCB Technology Roadmap – Flex

Item201620172018
Layer5‐85-101-12
Board thickness (without stiffener)24‐32 mil24‐40 mil4‐40 mil
Tolerance of single layer±1.2 mil±1.0 mil±1.0 mil
Tolerance of double‐layer (≤12mil)±1.2 mil±1.2 mil±1.2 mil
Tolerance of multi‐layer (≤12mil)±1.2 mil±1.2 mil±1.2 mil
Tolerance of multi‐layer (12mil‐32mil)±10%±8%±5%
Tolerance of board thickness (including PI stiffener)±10%±10%±8%
Min. board size0.0788” * 0.2362” (without bridge)
0.3152” * 0.3152” (with bridge)
0.0788” * 0.1576” (without bridge)
0.3152” * 0.3152” (with bridge)
0.0788” * 0.1576” (without bridge)
0.3152” * 0.3152” (with bridge)
Max. board size8.668” * 22.655”8.668” * 27.5”8.668” * 27.5”
Impedance control tolerance±4Ω (≤50Ω), ±8% (>50Ω)±4Ω (≤50Ω), ±7% (>50Ω)±5Ω (≤50Ω), ±7% (>50Ω)
Min. coverlay bridge8 mil6 mil
Min. bend radius of single layer3‐6 times of board thickness3‐6 times of board thickness3‐6 times of board thickness
Min. bend radius of double‐layer7‐10 times of board thickness

7‐10 times of board thickness
Min. bend radius of multi‐layer10‐15 times of board thickness10‐15 times of board thickness10‐15 times of board thickness
Min. mechanical drill hole5 mil4 mil4 mil
Inner Layer Trace/ Space3.0 / 3.0 mil2.5 / 2.5 mil2 / 2 mil
Outer Layer Trace/ Space3.0 / 3.0 mil2.5 / 2.5 mil2 / 2 mil
Solder mask colorgreenGreen\BlackGreen\Black
Surface treatmentHASL ,ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold, Immersion silver and OSP, Immersion tin
Laser accuracy (Routing)±2 mil±2 mil±2 mil
Punching accuracy (Routing)±2 mil ‐ ±6 mil±2 mil ‐ ±6 mil±2 mil ‐ ±6 mil

PCB Technology Roadmap – Rigid Flex

Item201620172018
Layer2-242-302-40
Board thickness0.00788” - 0.1576”0.00788” – 0.1968”0.00788” – 0.1968”
Min. bow & twist1.5% (unsymmetrical)1.2% (unsymmetrical)0.75% (symmetrical),
1% (unsymmetrical)
Min. board size0.591” * 0.394”0.591” * 0.394”0.591” * 0.394”
Max. board size
15.76” * 28.76”15.76” * 30.1”15.76” * 30.1”
Tolerance of board thickness (Thickness≤1.0mm)±4 mil
±4 mil±4 mil
Tolerance of board thickness (Thickness>1.0mm)±10%±10%±10%
Impedance control tolerance±4Ω (≤50Ω),±8% (>50Ω)±4Ω (≤50Ω),±7% (>50Ω)±5Ω (≤50Ω),±7% (>50Ω)
Blind via4 mil‐6 mil3 mil‐6 mil3 mil‐6 mil
Max. buried via16 mil16 mil8 mil
Aspect ratio (mechanical drill)16:120:130:1
Aspect ratio (laser drill)0.8:11:11:1
Inner Layer Trace/ Space3.0 / 3.0 mil2.5 / 2.5 mil2.0 / 2.0 mil
Outer Layer Trace/ Space3.5 / 3.5 mil3.0 / 3.0 mil3.0 / 3.0 mil
Solder mask colorgreen, black, blue, red, matte green, white
Surface treatmentHASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion silver, Immersion tin and OSP, ENIG+OSP, ENIG+Gold finger, Electrical gold+ Gold fingers
Tolerance of board outline±4 mil±4 mil±4 mil

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